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Division:
Nonstructural Materials

Group:
Sealants, Elastomer & Adhesives

High Temple Workshop:
http://hightemple.udri.udayton.edu/


Dan McCray
 
  Daniel B. McCray

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Research Engineer
Sealants, Elastomer & Adhesives Group

Address:
300 College Park
Dayton OH 45469-0051
937-656-6009
fax: 937-656-4419

Dan McCray has over 14 years experience evaluating and characterizing structural adhesives and polymer matrix composite materials. This experience includes evaluating the physical and mechanical properties of adhesive and composite materials using standard and specialized test methods. Dan also has experience evaluating, optimizing and investigating effects of prebond surface preparation on adhesive bond durability and strength. The focus of his research has largely been on developing on-aircraft composite and adhesively bonded repair processes. Dan has extensive experience evaluating and optimizing repair materials and processes, demonstrating and transitioning this technology to aircraft maintainers and performing on-aircraft bonded repairs.

Dan has authored over 30 technical papers and reports and regularly provides presentations at various conferences and workshops. In addition, Dan has organized and served as co-chairman for technical sessions at conferences related to the topics of adhesive bonding and composite repair. Dan is also responsible for organizing and administering the High Temple Workshop, an annual workshop devoted to discussing advances in high temperature polymers and composites.

Education:

M.S., Materials Engineering, University of Dayton, 1997
B.S., Materials Science and Engineering, Wright State University, 1995
A.S., Engineering Science, Sinclair Community College, 1993

Affiliations:

Tau Beta Pi, The Engineering Honor Society
Alpha Sigma Mu, The International Professional Honor Society for Materials Science and Engineering
Society for the Advancement of Materials and Process Engineering (SAMPE)



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