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Failure Analysis Group

The Failure Analysis group performs both structural and electrical failure analysis.

The Structural Failure Analysis laboratory provides solutions to mechanical component and airframe failures, including mechanical and metallurgical joining of aluminum and advanced nickel-based, titanium-based, and refractory metals and nonmetallic and composite materials.

The Electronic/Electrical Failure Analysis laboratory analyzes, characterizes, and solves problems related to electrical components, including printed wiring boards, wiring, connectors, switches, solder joints, integrated circuits, and hybrid microcircuits.

Capabilities: 

Failure Analysis and Corrosion Control Group Collage

Contact:

Peter Sjöblom
Acting Group Leader

Materials Engineering Division

300 College Park
Dayton, Ohio 45469-0032
937-656-9165



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